Ищу инженера в области фотонной упаковки и промышленного трансфера

[larisik]

Компания находится в Гренобле. Рассматриваются кандидаты из России или русские, уже работающие во Франции, конечно же - французы и другие европейцы. Высокий уровень английского языка + французский (либо готовность интенсивно изучать).

LETI is fully committed to accelerate innovation in silicon photonics and is now looking for a highly motivated

Research Engineer in the field of Photonic Packaging and Industrial Transfer.

Who will join the Assembly and Packaging Laboratory of LETI Optronics department, in Grenoble, France.

Your mission :
Support semi conductor device R&D and customer sampling, by providing high performance, consistent packaging platform for new generations of Photonic Integrated Circuits on silicon .
Bring innovation in the assembly processes and dramatically reduce packaging costs of optoelectronic devices. The goal is to make silicon photonics technology suitable for mass production and leverage the full deployment of this technology in the field of datacom, telecom and computer datalinks, at board or chip level.
The chosen researcher will be a major contributor to design, modeling and fabrication of test vehicles and prototypes, with strong focus on high frequency performance of packaging (40 GHz and more) , ultimately enabling  100 Gbps/s module operations. He will be working with a lead engineer, in charge of overall component and module architecture, a project manager and various technicians in charge of assembly processes.
The focus will be on technical solutions, compatible with CMOS manufacturing used for the fabrication of the chips and with high volume packaging manufacturing. This R&D activity is driven by world class industrial partners, in the field of microelectronic and optoelectronics components.

Candidate profile:
Highly motivated candidate for the development of Silicon photonics technology, with Masters or PhD education, in the field of optoelectronics, physics, RF electronics and/or opto-mechanics, preferably with a first experience in the design of High Frequency devices or Packaging of microelectronic or optoelectronic components.
The candidate should feel at ease with modeling (analytically or using computer soft wares) of the various phenomena involved in the design of new photonic packaging (thermal mapping, mechanical stress/strain, impedance matching, optical coupling…).
A strong drive to bring new concepts to manufacturing is expected from good candidates.

Please send resume and application letter to  : l_ribot@yahoo.fr
CEA Leti MINATEC website: www.leti.fr/en/Discover-Leti/About-us